Computational modelling of collagen-based flexible electronics: assessing the effect of hydration

Abstract Collagen substrates in flexible electronics emerged as an alternative to the commonly used stretchable synthetic polymers such polyethylene terephthalate, polyether sulfone, polydimethylsiloxane etc., thanks their biocompatibility, flexibility and piezoelectric behaviour. Although researchers were successful manufacturing these flexible-electronics component, still, mismatch levels of stiffness between a softer polymeric substrate stiffer metallic layer (electrodes) might cause interfacial delamination. In use, collagen-based be exposed both dry wet conditions. Experimental analysis showed drastic change mechanical behaviour for two conditions (the modulus changed by three orders magnitude); hence, it is essential investigate polymer-metal interface situations. addition, effect geometry orientation layers should also considered; this could help optimize design electronic devices. study, 3D computational models developed Abaqus Simulia CAE with dimensions similar those elements electronics—collagen (substrate) being base while gold (conductive) chromium (adhesive) top middle layers, respectively. It was found that delamination collagen much less pronounced slower compared collagen. The effects significant differences pattern area